DCG80 series electronic die-cutting special cutting machine provides professional solutions for electronic industry with multiple specifications, small batches, knife-free dies, fast die cutting and proofing. In addition to all the functions of the DCG30 / DCG50 system models, it is equipped with a new force control head and laser positioning to achieve precise control of cutting pressure and positioning cutting, which greatly improves the cutting effect and quality. It is maturely used in FPC, membrane switch, photoelectric, cover film, thermal conductive material, self-adhesive stickers and other industries; it has the advantages of high accuracy, fast speed, low test operation cost, and high cutting quality. Different from knife mold and laser cutting machine.
3M double-sided tape, optoelectronic materials (shading sheet, diffusion sheet, reflective sheet), insulating materials, thin film switches, light-increasing film reflective film optoelectronic products, FPC, adhesive products, thermal conductive materials, insulating materials, film and other auxiliary materials Texture
Machine type |
DCG801209 |
DCG800906 |
DCG810906 |
Effective processing area |
1200*900mm |
900*600mm |
900*600mm |
Configuration |
Pen, Force Control Knife, Laser Positioning |
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Adsorption method |
vacuum |
Static electricity |
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transfer method |
Timing belt drive |
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Cutting method |
Full knife, half knife, drawing |
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Knife and pen type |
Knife: Special tungsten steel knife / Pen: ordinary signature pen, water-based ballpoint pen, oil-based ballpoint pen |
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Maximum speed |
1000mm/s |
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Cutting thickness |
≤1mm |
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Minimum cutting circle diameter |
Φ 1mm |
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Precision |
≤0.01mm |
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Transmission port |
Parallel / Serial |
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Instruction system |
HPGL DXF |
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Voltage |
220v±10% 50Hz |
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Land size (length * width * height) |
1635*1365*1080mm |
1335*1065*1080mm |
1335*1065*1080mm |
Remark |
Other sizes can be customized |