DCG50 / DCG51 series special cutting machine for electronic die-cutting provides professional solutions for proofing in the electronics industry. It is maturely used in FPC, membrane switch, photoelectric, cover film and other industries; it can cut various electronic material films, stickers and other materials. Unlike knife die and laser cutting machine, DCG50 series adopts vacuum adsorption material, while DCG51 series adopts electrostatic adsorption method. Depending on the cutting material and application industry, it can also be called electronic die cutting machine, laser die plotter, sticker cutting machine, film cutting machine, lamp cover cutting machine, etc.
3M double-sided tape, optoelectronic materials (shading sheet, diffusion sheet, reflective sheet), insulating materials, thin film switches, light-increasing film reflective film optoelectronic products, FPC, adhesive products, thermal conductive materials, insulating materials, film and other auxiliary materials Texture
Model |
DCG501209 |
DCG500906 |
DCG510906 |
Effective processing area |
1200*900mm |
900*600mm |
900*600mm |
Configuration |
Knife: Special tungsten steel knife / Pen: ordinary signature pen, water-based ballpoint pen, oil-based ballpoint pen |
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Adsorption method |
vacuum |
Static electricity |
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Maximum speed |
1000mm/s |
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Cutting thickness |
≤1mm |
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Minimum cutting circle diameter |
Φ 1mm |
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Accuracy |
≤0.05mm |
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Cutting method |
Full knife, half knife, pen |
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Transmission port |
Serial port |
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Instruction system |
HPGL DXF |
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Voltage |
220v±10% 50Hz |
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Land size (length * width * height) |
1635*1365*1080mm |
1335*1065*1080mm |
1335*1065*1080mm |
Remark |
Other sizes can be customized |